Electrostatic adhesive design and optimization
Tutor / directorSpenko, Matthew
CovenanteeIllinois Institute of Technology
Document typeMaster thesis (pre-Bologna period)
Rights accessRestricted access - author's decision
Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses a voltage, which is applied using electrodes in an electroadhesive device. The voltage produces an electric field and electrostatic adherence forces. When the electroadhesive device and electrodes are positioned near a surface of an object such as a vertical wall, the electrostatic forces can be used to increase traction or maintain the position of the electroadhesive device relative to a surface. Electric control of the electrostatic adhesion voltage permits the adhesion to be controllably and readily turned on and off. Electrostatic adhesion will be investigated through experiments and simulations. The expected outcome of the research is a prototype adhesive optimized for skin or cloth. For this purpose, simulation results will be statistically studied in order to describe the relations between some of the pads geometry parameters and the obtained attachment pressure. A model that explains the variability of the electric field in a 93% has been found. The explanatory variables involved are the number of electrodes, the gap between electrodes and the electrode’s width. Eventually, the applied voltage has been involved in the final model. From the model interpretation we can conclude that the electric field is directly proportional to the applied voltage. Also, the model shows that a higher number of electrodes will give a more intense electric field. Also the electrode’s width has a positive effect on the electric field. On the other hand, smaller gap between electrodes gives more intense electric fields. It also has been found that the electrostatic force simulated by the Autodesk Simulation software doesn’t agree with the experimental results.
DegreeENGINYERIA INDUSTRIAL (Pla 1994)
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