SP2 - Test, Reliability and Functional Safety Trends for Automotive System-on-Chip

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dc.contributor.authorAngione, F.
dc.contributor.authorAppello, D.
dc.contributor.authorAribido, J.
dc.contributor.authorAthavale, J.
dc.contributor.authorBellarmino, N.
dc.contributor.authorBernardi, P.
dc.contributor.authorCantoro, R.
dc.contributor.authorDe Sio, C.
dc.contributor.authorFoscale, T.
dc.contributor.authorGavarini, G.
dc.contributor.authorGuerrero, J.
dc.contributor.authorHuch, M.
dc.contributor.authorIaria, G.
dc.contributor.authorKilian, T.
dc.contributor.authorMariani, R.
dc.contributor.authorMartone, R.
dc.contributor.authorRuospo, A.
dc.contributor.authorSanchez, E.
dc.contributor.authorSchlichtmann, U.
dc.contributor.authorSquillero, G.
dc.contributor.authorSonza Reorda, M.
dc.contributor.authorSterpone, L.
dc.contributor.authorTancorre, V.
dc.contributor.authorUgioli, R.
dc.date.accessioned2022-07-08T08:55:00Z
dc.date.issued2022-05
dc.description.abstractThis paper encompasses three contributions by industry professionals and university researchers. The contributions describe different trends in automotive products, including both manufacturing test and run-time reliability strategies. The subjects considered in this session deal with critical factors, from optimizing the final test before shipment to market to in-field reliability during operative life.
dc.format.extent10 p.
dc.identifier.citationAngione, F. [et al.]. SP2 - Test, Reliability and Functional Safety Trends for Automotive System-on-Chip. A: 27th IEEE European Test Symposium (ETS). 2022,
dc.identifier.urihttps://hdl.handle.net/2117/372166
dc.language.isoeng
dc.relation.publisherversionhttps://ieeexplore.ieee.org/xpl/conhome/9810327/proceeding
dc.rights.accessRestricted access - publisher's policy
dc.rights.licensenameAttribution-NonCommercial-NoDerivatives 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica
dc.subject.lcshMicroelectronics
dc.subject.lcshIntegrated circuits
dc.subject.lcshSpintronics
dc.subject.lemacMicroelectrònica
dc.subject.lemacCircuits integrats
dc.subject.lemacEspintrònica
dc.subject.otherDNNs reliability
dc.subject.otherInter-wafer performance variation estimation
dc.subject.otherSLT-BI automatic test equipment
dc.titleSP2 - Test, Reliability and Functional Safety Trends for Automotive System-on-Chip
dc.typeConference report
dspace.entity.typePublication
local.citation.contributor27th IEEE European Test Symposium (ETS)

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27th IEEE European Test Symposium (ETS): Barcelona, 23-27 may, 2022