Interconnects for DNA, quantum, in-memory and optical computing: insights from a panel discussion

dc.contributor.authorGanguly, Amlan
dc.contributor.authorAbadal Cavallé, Sergi
dc.contributor.authorThakkar, Ishan
dc.contributor.authorEnright Jerger, Natalie
dc.contributor.authorRiedel, Marc
dc.contributor.authorBabaie, Masoud
dc.contributor.authorBalasubramonian, Rajeev
dc.contributor.authorSebastian, Abu
dc.contributor.authorPasricha, Sudeep
dc.contributor.authorTaskin, Baris
dc.contributor.groupUniversitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
dc.date.accessioned2022-05-19T11:02:33Z
dc.date.available2022-05-19T11:02:33Z
dc.date.issued2022-06
dc.description.abstractThe computing world is witnessing a proverbial Cambrian explosion of emerging paradigms propelled by applications such as Artificial Intelligence, Big Data, and Cybersecurity. The recent advances in technology to store digital data inside a DNA strand, manipulate quantum bits (qubits), perform logical operations with photons, and perform computations inside memory systems are ushering in the era of emerging paradigms of DNA computing, quantum computing, optical computing, and in-memory computing. In an orthogonal direction, research on interconnect design using advanced electro-optic, wireless, and microfluidic technologies has shown promising solutions to the architectural limitations of traditional von-Neumann computers. In this article, experts present their comments on the role of interconnects in the emerging computing paradigms and discuss the potential use of chiplet-based architectures for the heterogeneous integration of such technologies.
dc.description.peerreviewedPeer Reviewed
dc.description.sponsorshipThis work was supported in part by the US NSF CAREER Grant CNS-1553264 and EU H2020 research and innovation programme under Grant 863337.
dc.description.versionPostprint (author's final draft)
dc.format.extent11 p.
dc.identifier.citationGanguly, A. [et al.]. Interconnects for DNA, quantum, in-memory and optical computing: insights from a panel discussion. "IEEE micro", Maig-Juny 2022, vol. 42, núm. 3, p. 40-49.
dc.identifier.doi10.1109/MM.2022.3150684
dc.identifier.issn1937-4143
dc.identifier.urihttps://hdl.handle.net/2117/367524
dc.language.isoeng
dc.relation.projectidinfo:eu-repo/grantAgreement/EC/H2020/863337/EU/Architecting More Than Moore – Wireless Plasticity for Heterogeneous Massive Computer Architectures/WiPLASH
dc.relation.publisherversionhttps://ieeexplore.ieee.org/document/9714013
dc.rights.accessOpen Access
dc.subjectÀrees temàtiques de la UPC::Informàtica::Arquitectura de computadors
dc.subject.lcshQuantum computers
dc.subject.lcshDeep learning
dc.subject.lcshWireless communications systems
dc.subject.lemacOrdinadors quàntics
dc.subject.lemacAprenentatge profund
dc.subject.lemacComunicació sense fil, Sistemes de
dc.subject.otherDNA computing
dc.subject.otherOptical computing
dc.subject.otherQuantum computing
dc.subject.otherIn-Memory computing
dc.subject.otherPhotonic interconnects
dc.subject.otherWireless interconnects
dc.titleInterconnects for DNA, quantum, in-memory and optical computing: insights from a panel discussion
dc.typeArticle
dspace.entity.typePublication
local.citation.authorGanguly, A.; Abadal, S.; Thakkar, I.; Enright, N.; Riedel, M.; Babaie, M.; Balasubramonian, R.; Sebastian, A.; Pasricha, S.; Taskin, B.
local.citation.endingPage49
local.citation.number3
local.citation.publicationNameIEEE micro
local.citation.startingPage40
local.citation.volume42
local.identifier.drac32836040

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