Exploració per tema "Built-in self-test (BIST)"
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Prebond testing of weak defects in TSVs
(2015-08-07)
Article
Accés restringit per política de l'editorialThrough-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects during fabrication and lifetime. It is desirable to detect defective TSVs in the early steps of the fabrication process ...