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  • Single-Step multiple-layers wafer slicing from macroporous silicon 

    Garin Escriva, Moises; Hernández García, David; Todorov Trifonov, Trifon; Cardador Maza, David; Alcubilla González, Ramón (2013)
    Conference report
    Open Access
    There is a rising interest, from both photovoltaics and microelectronics industry, in wafer thickness reduction. During the last decade, it has been steadily reduced from 350 µm to 180 µm, but benefits are foreseen for ...