Exploració per tema "Wafering"
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Single-Step multiple-layers wafer slicing from macroporous silicon
(2013)
Text en actes de congrés
Accés obertThere is a rising interest, from both photovoltaics and microelectronics industry, in wafer thickness reduction. During the last decade, it has been steadily reduced from 350 µm to 180 µm, but benefits are foreseen for ...