Browsing by Author "Arumi Delgado, Daniel"
Now showing items 1-20 of 35
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8T SRAM Cell with Open Defects under Voltage and Timing Variations
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Castillo Muñoz, Raul (2011)
Conference report
Open Access -
A forming-free ReRAM cell with low operating voltage
Yang, Binbin; Xu, Nuo; Li, Cheng; Huang, Chenglong; Ma, Desheng; Liu, Jiahao; Arumi Delgado, Daniel; Fang, Liang (2020-11-25)
Article
Open AccessThe unwanted electro-forming process is unavoidable for the practical application of most resistive random access memory (ReRAM) devices, which is always being one of the obstacles for the massive commercialization of this ... -
Backside polishing detector: a new protection against backside attacks
Manich Bou, Salvador; Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Mujal Colell, Jordi; Hernández García, David (2015)
Conference report
Open AccessSecure chips are in permanent risk of attacks. Physical attacks usually start removing part of the package and accessing the dice by different means: laser shots, electrical or electromagnetic probes, etc. Doing this ... -
BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing
Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan (Institute of Electrical and Electronics Engineers (IEEE), 2013)
Conference report
Restricted access - publisher's policyThrough Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs). The detection of defective TSVs in the earliest process step is of major concern. Hence, testing TSVs is usually done ... -
Defective Behaviour of an 8T SRAM Cell with Open Defects
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Manich Bou, Salvador; Figueras Pàmies, Joan; Di Carlo, Stefano; Prinetto, Paolo; Scionti, Alberto (2010)
Conference report
Restricted access - publisher's policy -
Design and validation of a platform for electromagnetic fault injection
Balasch, Josep; Arumi Delgado, Daniel; Manich Bou, Salvador (Institute of Electrical and Electronics Engineers (IEEE), 2018)
Conference report
Open AccessSecurity is acknowledged as one of the main challenges in the design and deployment of embedded circuits. Devices need to operate on-the-field safely and correctly, even when at physical reach of potential adversaries. One ... -
Diagnosis of full open defects in interconnect lines with fan-out
Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, C.; Kruseman, Bram (IEEE Press. Institute of Electrical and Electronics Engineers, 2010-05-24)
Conference report
Open AccessThe development of accurate diagnosis methodologies is important to solve process problems and achieve fast yield improvement. As open defects are common in CMOS technologies, accurate diagnosis of open defects becomes ... -
Diagnosis of full open defects in interconnecting lines
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, Camelia; Kruseman, Bram; Lousberg, M.; Majhi, A.K. (IEEE, 2007-05-31)
Conference report
Open AccessA proposal for enhancing the diagnosis of full open defects in interconnecting lines of CMOS circuits is presented. The defective line is first classified as fully opened by means of a logic-based diagnosis tool (Faloc). ... -
Enhanced serial RRAM cell for unpredictable bit generation
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Gómez-Pau, Álvaro; Manich Bou, Salvador; Bargalló González, Mireia; Campabadal, Francesca (2021-05)
Article
Open AccessIn this letter, the serial configuration of two RRAMs is used as a basic cell to generate an unpredictable bit. The basis of the operation considers starting from the Low Resistive State (LRS) in both devices (initialization ... -
ETS 2022 ORGANIZING COMMITTEE
Manich Bou, Salvador; Rodríguez Montañés, Rosa; Bernardi, Paolo; Tille, Daniel; Mir, Salvador; Bosio, Alberto; Arumi Delgado, Daniel; Gómez Pau, Álvaro; Cassano, Luca; Jiao, Hailong; Miclea, Liviu; Sanchez, Ernesto; Savino, Alessandro; Canal Corretger, Ramon; Eggersglüß, Stephan; Fransi, Sergi; Taouil, Mottaqiallah; Calomarde Palomino, Antonio; Weiner, Michael; Michael, Maria K.; Sonza Reorda, Matteo; Larsson, Erik; Vatajelu, Elena-Ioana; Stratigopoulos, Haralampos-G.; Parisi Baradad, Vicenç; Jiao, Hailong; Huang, Junlin; Li, Huawei; Chillarige, Sameer; Kameyama, Shuichi; Carro, Luigi; Su, Fei; Nicolici, Nicola; Huang, Shi-Yu (2022-05)
Conference report
Open Access -
Gate leakage impact on full open defects in interconnect lines
Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, Camelia; Kruseman, Bram (2011-06)
Article
Open AccessAn Interconnect full open defect breaks the connection between the driver and the gate terminals of downstream transistors, generating a floating line. The behavior of floating lines is known to depend on several factors, ... -
Granada-UGR-VCMTCF model engineering
Mahboubi, Vahab; Manich Bou, Salvador; Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Gómez Pau, Álvaro; Calomarde Palomino, Antonio (2024-03-05)
Research report
Open AccessTiN/Ti/HfO2/W RRAMs operate based on resistive switching phenomena, enabling reversible switching between high and low resistance states with electrical stimuli. UGR-VCMTCF model developed at Granada university, which is ... -
Impact of gate tunnelling leakage on CMOS circuits with full open defects
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Eichenberger, S.; Hora, Camelia; Kruseman, B. (Institution of Electrical Engineers, 2007-10)
Article
Open AccessInterconnecting lines with full open defects become floating lines. In nanometric CMOS technologies, gate tunnelling leakage currents impact the behaviour of these lines, which cannot be considered electrically isolated ... -
Impact of laser attacks on the switching behavior of RRAM devices
Arumi Delgado, Daniel; Manich Bou, Salvador; Gómez Pau, Álvaro; Rodríguez Montañés, Rosa; Montilla, Víctor; Hernández, David; Bargalló González, Mireia; Campabadal, Francesca (2020-01-20)
Article
Open AccessThe ubiquitous use of critical and private data in electronic format requires reliable and secure embedded systems for IoT devices. In this context, RRAMs (Resistive Random Access Memories) arises as a promising alternative ... -
Localization and electrical characterization of interconnect open defects
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Beverloo, Willem; Vries, Dirk K. de; Eichenberger, Stefan; Volf, Paul A. J. (2010-02)
Article
Open AccessA technique for extracting the electrical and topological parameters of open defects in process monitor lines is presented. The procedure is based on frequency-domain measurements performed at both end points of the ... -
Low Cost AES Protection Against DPA Using Rolling Codes
Albiol Perarnau, Pau; Manich Bou, Salvador; Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Gómez-Pau, Álvaro (Curran Associates, Inc., 2021)
Conference report
Restricted access - publisher's policyMany block cipher algorithms like AES are known to be weak against differential power analysis attacks (DPA) if the executing unit presents certain levels of information leakage, which is a common problem in microprocessors. ... -
On the fitting and improvement of RRAM stanford-based model parameters using TiN/Ti/HfO2/W experimental data
Mahboubi, Vahab; Arumi Delgado, Daniel; Gómez Pau, Álvaro; Rodríguez Montañés, Rosa; Manich Bou, Salvador (Institute of Electrical and Electronics Engineers (IEEE), 2022)
Conference lecture
Restricted access - publisher's policyThe use of Resistive Random Access Memory (RRAM) devices is becoming pervasive in many applications. In particular, security based primitives can exploit their variability and non-volatility for generating cells for ... -
Post-Bond test of through-silicon vias with open defects
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan (2014)
Conference report
Restricted access - publisher's policyThrough Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs) and are susceptible to undergo defects at different stages: during their own fabrication, the bonding stage or during ... -
Postbond test of through-silicon vias with resistive open defects
Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan (2019-07-17)
Article
Open AccessThrough-silicon vias (TSVs) technology has attracted industry interest as a way to achieve high bandwidth, and short interconnect delays in nanometer three-dimensional integrated circuits (3-D ICs). However, TSVs are ... -
Prebond testing of weak defects in TSVs
Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan (2015-08-07)
Article
Restricted access - publisher's policyThrough-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects during fabrication and lifetime. It is desirable to detect defective TSVs in the early steps of the fabrication process ...