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Backside polishing detector: a new protection against backside attacks
dc.contributor.author | Manich Bou, Salvador |
dc.contributor.author | Arumi Delgado, Daniel |
dc.contributor.author | Rodríguez Montañés, Rosa |
dc.contributor.author | Mujal Colell, Jordi |
dc.contributor.author | Hernández García, David |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2016-03-16T20:11:37Z |
dc.date.available | 2016-03-16T20:11:37Z |
dc.date.issued | 2015 |
dc.identifier.citation | Manich, S., Arumi, D., Rodriguez, R., Mujal, J., Hernandez, D. Backside polishing detector: a new protection against backside attacks. A: Conference on Design of Circuits and Integrated Systems. "DCIS'15 - XXX Conference on Design of Circuits and Integrated Systems". Estoril: 2015, p.1-6 |
dc.identifier.uri | http://hdl.handle.net/2117/84577 |
dc.description.abstract | Secure chips are in permanent risk of attacks. Physical attacks usually start removing part of the package and accessing the dice by different means: laser shots, electrical or electromagnetic probes, etc. Doing this from the backside of the chip gives some advantages since no metal layers interfere between the hacker and the signals of interest. The bulk silicon is thinned from hundreds to some tens of micrometers in order to improve the performance of the attack. In this paper a backside polishing detector is presented that is sensitive to the thickness of the bulk silicon existing below the transistors, a numerical signature is generated which is related to this. The detector implements built-in self-surveillance techniques which protect it from being tampered. |
dc.format.extent | 6 p. |
dc.language.iso | eng |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
dc.subject | Àrees temàtiques de la UPC::Informàtica::Seguretat informàtica |
dc.subject.lcsh | Smart cards -- Security measures |
dc.subject.lcsh | Computer security |
dc.subject.lcsh | Integrated circuits -- Security measures |
dc.subject.lcsh | Detectors |
dc.subject.lcsh | Electronic surveillance |
dc.subject.other | Attack Detector |
dc.subject.other | Security |
dc.subject.other | TSV |
dc.subject.other | Phase Detector |
dc.subject.other | Built-in Self Surveillance |
dc.title | Backside polishing detector: a new protection against backside attacks |
dc.type | Conference report |
dc.subject.lemac | Targetes intel·ligents -- Mesures de seguretat |
dc.subject.lemac | Seguretat informàtica |
dc.subject.lemac | Circuits integrats -- Mesures de seguretat |
dc.subject.lemac | Detectors |
dc.subject.lemac | Vigilància electrònica |
dc.contributor.group | Universitat Politècnica de Catalunya. QINE - Disseny de Baix Consum, Test, Verificació i Circuits Integrats de Seguretat |
dc.relation.publisherversion | http://146.193.44.212/wordpress/wp-content/uploads/2015/11/DCIS2015_program_tech.pdf |
dc.rights.access | Open Access |
local.identifier.drac | 17363374 |
dc.description.version | Postprint (published version) |
local.citation.author | Manich, S.; Arumi, D.; Rodriguez, R.; Mujal, J.; Hernandez, D. |
local.citation.contributor | Conference on Design of Circuits and Integrated Systems |
local.citation.pubplace | Estoril |
local.citation.publicationName | DCIS'15 - XXX Conference on Design of Circuits and Integrated Systems |