Articles de revista
Open AccessIntragate open defects are responsible for a significant percentage of defects in present technologies. A majority of these defects causes the logic gate to become stuck open, and this is why they are traditionally modeled ...
Open AccessBinning after volume production is a widely accepted technique to classify fabricated ICs into different clusters depending on different degrees of specification compliance. This allows the manufacturer to sell non optimal ...
Restricted access - publisher's policyThrough-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects during fabrication and lifetime. It is desirable to detect defective TSVs in the early steps of the fabrication process ...