Enviaments recents

  • Defending cache memory against cold-boot attacks boosted by power or EM radiation analysis 

    Neagu, Madalin; Manich Bou, Salvador (2017-04)
    Article
    Accés restringit per política de l'editorial
    Some algorithms running with compromised data select cache memory as a type of secure memory where data is confined and not transferred to main memory. However, cold-boot attacks that target cache memories exploit the data ...
  • Multi-directional space tessellation to improve the decision boundary in indirect mixed-signal testing 

    Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2017-02-20)
    Article
    Accés restringit per política de l'editorial
    One of the most challenging aspects in nowadays microelectronics industry is production test and verification of mixed-signal circuits. In order to cope with some of the drawbacks encountered in this scenario, researchers ...
  • Indirect test of M-S circuits using multiple specification band guarding 

    Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2016-09-01)
    Article
    Accés restringit per política de l'editorial
    Testing analog and mixed-signal circuits is a costly task due to the required test time targets and high end technical resources. Indirect testing methods partially address these issues providing an efficient solution using ...
  • Test escapes of stuck-open faults caused by parasitic capacitances and leakage currents 

    Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras, Joan (2015-09-24)
    Article
    Accés obert
    Intragate open defects are responsible for a significant percentage of defects in present technologies. A majority of these defects causes the logic gate to become stuck open, and this is why they are traditionally modeled ...
  • Efficient production binning using octree tessellation in the alternate measurements space 

    Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2015)
    Article
    Accés obert
    Binning after volume production is a widely accepted technique to classify fabricated ICs into different clusters depending on different degrees of specification compliance. This allows the manufacturer to sell non optimal ...
  • Prebond testing of weak defects in TSVs 

    Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan (2015-08-07)
    Article
    Accés restringit per política de l'editorial
    Through-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects during fabrication and lifetime. It is desirable to detect defective TSVs in the early steps of the fabrication process ...

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