Lithography parametric yield estimation model to predict layout pattern distortions with a reduced set of lithography simulations
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A lithography parametric yield estimation model is presented to evaluate the lithography distortion in a printed layout due to lithography hotspots. The aim of the proposed yield model is to provide a new metric that enables the possibility to objectively compare the lithography quality of different layout design implementations. Moreover, we propose a pattern construct classifier to reduce the set of lithography simulations necessary to estimate the litho degradation. The application of the yield model is demonstrated for different layout configurations showing that a certain degree of layout regularity improves the parametric yield and increases the number of good dies per wafer. (C) 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)
CitacióGomez, S.; Moll, F.; Mauricio, J. Lithography parametric yield estimation model to predict layout pattern distortions with a reduced set of lithography simulations. "Journal of micro/nanolithography, MEMS and MOEMS", 01 Juliol 2014, vol. 13, núm. 3.