A lithography parametric yield estimation model is presented to evaluate the lithography distortion in a printed layout due to lithography hotspots. The aim of the proposed yield model is to provide a new metric that enables the possibility to objectively compare the lithography quality of different layout design implementations. Moreover, we propose a pattern construct classifier to reduce the set of lithography simulations necessary to estimate the litho degradation. The application of the yield model is demonstrated for different layout configurations showing that a certain degree of layout regularity improves the parametric yield and increases the number of good dies per wafer. (C) 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)
CitationGomez, S.; Moll, F.; Mauricio, J. Lithography parametric yield estimation model to predict layout pattern distortions with a reduced set of lithography simulations. "Journal of micro/nanolithography, MEMS and MOEMS", 01 Juliol 2014, vol. 13, núm. 3.
All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder. If you wish to make any use of the work not provided for in the law, please contact: email@example.com