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Experiments show that air breakdown and substrate carrier conduction can be responsible of the
dielectric charging of microelectromechanical devices after electrical stress. Test conducted under
vacuum allows us to isolate the two mechanisms. It is also shown that the relative importance of the
two mechanisms depends on the dielectric nature and technology.
CitationMolinero, D.; Castañer, L. Comparison of air gap breakdown and substrate injection as mechanisms to induce dielectric charching in microelectromechanical switches. A: Applied Physics Letters, 2008, vol. 92, 043502.
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