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Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits
dc.contributor.author | Mateo Peña, Diego |
dc.contributor.author | Altet Sanahujes, Josep |
dc.contributor.author | Gómez Salinas, Dídac |
dc.contributor.author | Aragonès Cervera, Xavier |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2014-03-13T17:55:38Z |
dc.date.created | 2013 |
dc.date.issued | 2013 |
dc.identifier.citation | Mateo, D. [et al.]. Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits. A: International Conference on Materials Engineering for Resources. "ICMR 2013 AKITA: International Conference on Materials Engineering for Resources: November 20 Wed.-22 Fri., 2013: Akita View Hotel, Akita City, Japan". Akita City: 2013, p. 73-76. |
dc.identifier.uri | http://hdl.handle.net/2117/22055 |
dc.description.abstract | This paper introduces a novel on-chip measurement technique for the determination of the central frequency and 3dB bandwidth of a 60GHz power amplifier (PA) by performing low frequency temperature measurements in silicon integrated circuits. The techniques is implemented by using a temperature sensor embedded in the same silicon die as the PA, and placed in empty spaces next to it. Results confirm that temperature sensors can be used as functional built-in testers which serve to reduce testing costs and enhance yield as part of self-healing strategies. |
dc.format.extent | 4 p. |
dc.language.iso | eng |
dc.rights | Attribution-NonCommercial-NoDerivs 3.0 Spain |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats |
dc.subject.lcsh | Materials -- Congresses |
dc.subject.lcsh | Integrated circuits |
dc.subject.other | Silicon temperature measurement |
dc.subject.other | CMOS millimeter wave integrated circuits |
dc.subject.other | Design for Testability |
dc.title | Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits |
dc.type | Conference report |
dc.subject.lemac | Materials -- Congressos |
dc.subject.lemac | Circuits integrats |
dc.contributor.group | Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
dc.description.peerreviewed | Peer Reviewed |
dc.relation.publisherversion | http://smerj.ie.akita-u.ac.jp/icmr/icmr.htm |
dc.rights.access | Restricted access - publisher's policy |
local.identifier.drac | 13394083 |
dc.description.version | Postprint (published version) |
dc.date.lift | 10000-01-01 |
local.citation.author | Mateo, D.; Altet, J.; Gómez, D.; Aragones, X. |
local.citation.contributor | International Conference on Materials Engineering for Resources |
local.citation.pubplace | Akita City |
local.citation.publicationName | ICMR 2013 AKITA: International Conference on Materials Engineering for Resources: November 20 Wed.-22 Fri., 2013: Akita View Hotel, Akita City, Japan |
local.citation.startingPage | 73 |
local.citation.endingPage | 76 |