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dc.contributor.authorMateo Peña, Diego
dc.contributor.authorAltet Sanahujes, Josep
dc.contributor.authorGómez Salinas, Dídac
dc.contributor.authorAragonès Cervera, Xavier
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2014-03-13T17:55:38Z
dc.date.created2013
dc.date.issued2013
dc.identifier.citationMateo, D. [et al.]. Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits. A: International Conference on Materials Engineering for Resources. "ICMR 2013 AKITA: International Conference on Materials Engineering for Resources: November 20 Wed.-22 Fri., 2013: Akita View Hotel, Akita City, Japan". Akita City: 2013, p. 73-76.
dc.identifier.urihttp://hdl.handle.net/2117/22055
dc.description.abstractThis paper introduces a novel on-chip measurement technique for the determination of the central frequency and 3dB bandwidth of a 60GHz power amplifier (PA) by performing low frequency temperature measurements in silicon integrated circuits. The techniques is implemented by using a temperature sensor embedded in the same silicon die as the PA, and placed in empty spaces next to it. Results confirm that temperature sensors can be used as functional built-in testers which serve to reduce testing costs and enhance yield as part of self-healing strategies.
dc.format.extent4 p.
dc.language.isoeng
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats
dc.subject.lcshMaterials -- Congresses
dc.subject.lcshIntegrated circuits
dc.subject.otherSilicon temperature measurement
dc.subject.otherCMOS millimeter wave integrated circuits
dc.subject.otherDesign for Testability
dc.titleTemperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits
dc.typeConference report
dc.subject.lemacMaterials -- Congressos
dc.subject.lemacCircuits integrats
dc.contributor.groupUniversitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://smerj.ie.akita-u.ac.jp/icmr/icmr.htm
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac13394083
dc.description.versionPostprint (published version)
dc.date.lift10000-01-01
local.citation.authorMateo, D.; Altet, J.; Gómez, D.; Aragones, X.
local.citation.contributorInternational Conference on Materials Engineering for Resources
local.citation.pubplaceAkita City
local.citation.publicationNameICMR 2013 AKITA: International Conference on Materials Engineering for Resources: November 20 Wed.-22 Fri., 2013: Akita View Hotel, Akita City, Japan
local.citation.startingPage73
local.citation.endingPage76


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