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Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion
dc.contributor.author | Higuera Cobos, Oscar Fabián |
dc.contributor.author | Cabrera Marrero, José M. |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament de Ciència dels Materials i Enginyeria Metal·lúrgica |
dc.date.accessioned | 2013-07-11T12:22:22Z |
dc.date.created | 2013-06-01 |
dc.date.issued | 2013-06-01 |
dc.identifier.citation | Higuera, O.; Cabrera, J. Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion. "Materials science and engineering A. Structural materials properties microstructure and processing", 01 Juny 2013, vol. 571, p. 103-114. |
dc.identifier.issn | 0921-5093 |
dc.identifier.uri | http://hdl.handle.net/2117/19921 |
dc.description.abstract | Samples of commercially pure copper (ETP copper) were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. Microstructural evolution was determined by oriented image microscopy (OIM) and differential scanning calorimetry (DSC) was used to estimate the stored deformation energy and the recrystallization temperature after each ECAP pass. On the other hand, electrical properties were correlated with the associated energy that results from the defects induced by ECAP. Results show that the stored energy rises on increasing ECAP deformation, while the recrystallization temperature decreases significatively. Also, mechanical properties after each pass were evaluated by tensile tests. Microstructural and mechanical features display that a stable microstructure is attained after four passes. Similarly, electrical conductivity decreases up to a saturation state at increasing ECAP passes. |
dc.format.extent | 12 p. |
dc.language.iso | eng |
dc.rights | Attribution-NonCommercial-NoDerivs 3.0 Spain |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
dc.subject | Àrees temàtiques de la UPC::Enginyeria dels materials |
dc.subject.lcsh | Materials--Electric properties |
dc.subject.other | Copper |
dc.subject.other | Differential scanning calorimetry (DSC) |
dc.subject.other | Electrical conductivity |
dc.subject.other | Electron backscattered diffraction (EBSD) |
dc.subject.other | Equal channel angular pressing (ECAP) |
dc.title | Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion |
dc.type | Article |
dc.subject.lemac | Materials electrotècnics |
dc.subject.lemac | Materials conductors |
dc.contributor.group | Universitat Politècnica de Catalunya. PROCOMAME - Processos de Conformació de Materials Metàl·lics |
dc.identifier.doi | 10.1016/j.msea.2013.01.076 |
dc.rights.access | Restricted access - publisher's policy |
local.identifier.drac | 12659791 |
dc.description.version | Postprint (published version) |
dc.date.lift | 10000-01-01 |
local.citation.author | Higuera, O.; Cabrera, J. |
local.citation.publicationName | Materials science and engineering A. Structural materials properties microstructure and processing |
local.citation.volume | 571 |
local.citation.startingPage | 103 |
local.citation.endingPage | 114 |
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