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dc.contributor.authorHiguera Cobos, Oscar Fabián
dc.contributor.authorCabrera Marrero, José M.
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Ciència dels Materials i Enginyeria Metal·lúrgica
dc.date.accessioned2013-07-11T12:22:22Z
dc.date.created2013-06-01
dc.date.issued2013-06-01
dc.identifier.citationHiguera, O.; Cabrera, J. Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion. "Materials science and engineering A. Structural materials properties microstructure and processing", 01 Juny 2013, vol. 571, p. 103-114.
dc.identifier.issn0921-5093
dc.identifier.urihttp://hdl.handle.net/2117/19921
dc.description.abstractSamples of commercially pure copper (ETP copper) were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. Microstructural evolution was determined by oriented image microscopy (OIM) and differential scanning calorimetry (DSC) was used to estimate the stored deformation energy and the recrystallization temperature after each ECAP pass. On the other hand, electrical properties were correlated with the associated energy that results from the defects induced by ECAP. Results show that the stored energy rises on increasing ECAP deformation, while the recrystallization temperature decreases significatively. Also, mechanical properties after each pass were evaluated by tensile tests. Microstructural and mechanical features display that a stable microstructure is attained after four passes. Similarly, electrical conductivity decreases up to a saturation state at increasing ECAP passes.
dc.format.extent12 p.
dc.language.isoeng
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria dels materials
dc.subject.lcshMaterials--Electric properties
dc.subject.otherCopper
dc.subject.otherDifferential scanning calorimetry (DSC)
dc.subject.otherElectrical conductivity
dc.subject.otherElectron backscattered diffraction (EBSD)
dc.subject.otherEqual channel angular pressing (ECAP)
dc.titleMechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion
dc.typeArticle
dc.subject.lemacMaterials electrotècnics
dc.subject.lemacMaterials conductors
dc.contributor.groupUniversitat Politècnica de Catalunya. PROCOMAME - Processos de Conformació de Materials Metàl·lics
dc.identifier.doi10.1016/j.msea.2013.01.076
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac12659791
dc.description.versionPostprint (published version)
dc.date.lift10000-01-01
local.citation.authorHiguera, O.; Cabrera, J.
local.citation.publicationNameMaterials science and engineering A. Structural materials properties microstructure and processing
local.citation.volume571
local.citation.startingPage103
local.citation.endingPage114


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