| Títol: | Bonding-wire triangular spiral inductor for on-chip switching power converters |
| Autor: | Villar Piqué, Gerard
Delós, Julià
Alarcón Cot, Eduardo José |
| Altres autors/autores: | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
| Editorial: | IEEE |
| Matèries: | Àrees temàtiques de la UPC::Enginyeria electrònica i telecomunicacions::Electrònica de potència
On-chip switching power converter
Bonding-wire
Convertidors de corrent elèctric |
| Tipus de document: | Conference report |
| Descripció: | This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27nH, 1 Ω) are presented to validate the proposed expressions |
| Altres identificadors i accés: | Villar, G.; Delós, J.; Alarcón, E. Bonding-wire triangular spiral inductor for on-chip switching power converters. A: IEEE International Symposium on Circuits and Systems. "ISCAS 2011 the IEEE International Symposium on Circuits and Systems: proceedings". Rio de Janeiro: IEEE, 2011, p. 817-820.
978-1-4244-9472-9
http://hdl.handle.net/2117/15368
10.1109/ISCAS.2011.5937691 |
| Disponible al dipòsit: | E-prints UPC
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