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This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27nH, 1 Ω) are presented to validate the proposed expressions
CitationVillar, G.; Delós, J.; Alarcón, E. Bonding-wire triangular spiral inductor for on-chip switching power converters. A: IEEE International Symposium on Circuits and Systems. "ISCAS 2011 the IEEE International Symposium on Circuits and Systems: proceedings". Rio de Janeiro: IEEE, 2011, p. 817-820.
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