This Letter presents a solution for locating hot spots in active integrated circuits (IC) and devices. This method is
based on sensing the phase lag between the power periodically dissipated by a device integrated in an IC (hot spot)
and its corresponding thermal gradient into the chip substrate by monitoring the heat-induced refractive index
gradient with a laser beam. The experimental results show a high accuracy and prove the suitability of this
technique to locate and characterize devices behaving as hot spots in current IC technologies.
CitationPerpiñà, X. [et al.]. Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect. "Optics Letters", 2010, vol. 35, núm. 15, p. 2657-2659.
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