This Letter presents a solution for locating hot spots in active integrated circuits (IC) and devices. This method is
based on sensing the phase lag between the power periodically dissipated by a device integrated in an IC (hot spot)
and its corresponding thermal gradient into the chip substrate by monitoring the heat-induced refractive index
gradient with a laser beam. The experimental results show a high accuracy and prove the suitability of this
technique to locate and characterize devices behaving as hot spots in current IC technologies.
CitationPerpiñà, X. [et al.]. Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect. "Optics Letters", 2010, vol. 35, núm. 15, p. 2657-2659.
All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder. If you wish to make any use of the work not provided for in the law, please contact: email@example.com