Four different approaches for the measurement of IC surface temperature: Application to thermal testing
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Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC. q 2002 Elsevier Science Ltd All rights reserved.
CitationAltet, J. [et al.]. Four different approaches for the measurement of IC surface temperature: Application to thermal testing. "Microelectronics journal", Setembre 2002, vol. 33, p. 689-696.
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