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High-power test device for package thermal assessment and validation of thermal measuremetn tecniques
dc.contributor.author | Jordà, Xavier |
dc.contributor.author | Perpiñà, Xavier |
dc.contributor.author | Vellvehi, Miquel |
dc.contributor.author | Madrid, Francesc |
dc.contributor.author | Altet Sanahujes, Josep |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2010-12-10T09:53:50Z |
dc.date.available | 2010-12-10T09:53:50Z |
dc.date.created | 2010 |
dc.date.issued | 2010 |
dc.identifier.citation | Jordà, X. [et al.]. High-power test device for package thermal assessment and validation of thermal measuremetn tecniques. A: 16th International workshop on Thermal investigations of ICs and Systems. "16th THERMINIC". Barcelona: IEEE Computer Society Publications, 2010, p. 90-93. |
dc.identifier.isbn | 978-2-35500-012-6 |
dc.identifier.uri | http://hdl.handle.net/2117/10519 |
dc.description.abstract | This paper describes the structure and thermal behavior of a high-power thermal test chip (up to 200 W/cm2) designed for power electronics package assessment, which has also been used for the validation of thermal measurement techniques. In particular, we show two application examples where the proposed device allowed the assessment of different power substrate technologies, and the validation of temperature measurement techniques used to characterize the high frequency behavior of circuits and devices in the frequency domain using the heterodyne technique. |
dc.format.extent | 4 p. |
dc.language.iso | eng |
dc.publisher | IEEE Computer Society Publications |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica |
dc.subject.lcsh | Thermal test chips |
dc.subject.lcsh | Resistance temperature detector |
dc.subject.lcsh | Electronics |
dc.title | High-power test device for package thermal assessment and validation of thermal measuremetn tecniques |
dc.type | Conference report |
dc.subject.lemac | Electrònica |
dc.contributor.group | Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
dc.rights.access | Open Access |
local.identifier.drac | 4448327 |
dc.description.version | Postprint (published version) |
local.citation.author | Jordà, X.; Perpiñà, X.; Vellvehi, M.; Madrid, F.; Altet, J. |
local.citation.contributor | 16th International workshop on Thermal investigations of ICs and Systems |
local.citation.pubplace | Barcelona |
local.citation.publicationName | 16th THERMINIC |
local.citation.startingPage | 90 |
local.citation.endingPage | 93 |