This paper describes the structure and thermal
behavior of a high-power thermal test chip (up to 200 W/cm2)
designed for power electronics package assessment, which has
also been used for the validation of thermal measurement
techniques. In particular, we show two application examples
where the proposed device allowed the assessment of different
power substrate technologies, and the validation of temperature
measurement techniques used to characterize the high
frequency behavior of circuits and devices in the frequency
domain using the heterodyne technique.
CitationJordà, X. [et al.]. High-power test device for package thermal assessment and validation of thermal measuremetn tecniques. A: 16th International workshop on Thermal investigations of ICs and Systems. "16th THERMINIC". Barcelona: IEEE Computer Society Publications, 2010, p. 90-93.
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