Transient thermal modelling of short-circuit test for conductors by means of dimensional reduction
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10.1109/POWERCON.2016.7753884
Inclou dades d'ús des de 2022
Cita com:
hdl:2117/100432
Tipus de documentText en actes de congrés
Data publicació2016
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Abstract
This paper proposes a fast and accurate method to simulate the temperature rise due to a short-circuit
condition in power conductors of aluminum based on one-dimensional reduction and the application of the finite
difference method (FDM). The method suggested discretizes the analyzed conductor into several small onedimensional
nodes or elements. To improve accuracy and speed, the transient method proposed here applies a onedimensional
approach but analyzing in each node, the three-dimensional geometry of the conductor. By this way, and
at each time-step, the convective coefficient and the incremental resistance of each node are determined and a further
energy balance is calculated, thus obtaining realistic and accurate results. Results attained by means of the proposed
method are validated against finite element method (FEM) simulations and experimental results conducted in a power
laboratory, which corroborate the usefulness and accurate results of the proposed method.
CitacióAbomailek, B., Capelli, F., Riba, J., Casals, P., Moreno-Eguilaz, J.M. Transient thermal modelling of short-circuit test for conductors by means of dimensional reduction. A: International Conference on Power System Technology. "Proceedings of the 2016 IEEE International Conference on Power System Technology (POWERCON)". Wollongong, NSW: 2016.
ISBN978-1-4673-8848-1
Versió de l'editorhttp://ieeexplore.ieee.org/document/7753884/
Fitxers | Descripció | Mida | Format | Visualitza |
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2016_04_29_POWERCON_submission.pdf | 512,2Kb | Accés restringit |