|
E-prints UPC >
Altres >
Enviament des de DRAC >
Empreu aquest identificador per citar o enllaçar aquest ítem:
http://hdl.handle.net/2117/10920
|
Ítem no disponible en accés obert per política de l'editorial
| Arxiu |
Descripció |
Mida | Format |
|---|
| paper_published.pdf | Article publicat | 500.25 kB | Adobe PDF |  |
|
| Citació: | Altet, J. [et al.]. Four different approaches for the measurement of IC surface temperature: Application to thermal testing. "Microelectronics journal", Setembre 2002, vol. 33, p. 689-696. |
| Títol: | Four different approaches for the measurement of IC surface temperature: Application to thermal testing |
| Autor: | Saulnier, J B; Altet Sanahujes, Josep  ; Dilhaire, S; Volz, S; Rampnoux, J M; Rubio Sola, Jose Antonio ; Grauby, S; Patino, L; Claeys, W |
| Data: | set-2002 |
| Tipus de document: | Article |
| Resum: | Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper,
four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential
temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty
digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the
detection and localisation of hot spots in an IC. q 2002 Elsevier Science Ltd All rights reserved. |
| ISSN: | 0026-2692 |
| URI: | http://hdl.handle.net/2117/10920 |
| Apareix a les col·leccions: | Altres. Enviament des de DRAC
Departament d'Enginyeria Electrònica. Articles de revista
HIPICS - High Performance Integrated Circuits and Systems. Articles de revista
|
| Comparteix: |
|
Aquest ítem (excepte textos i imatges no creats per l'autor) està subjecte a una llicència de Creative Commons Llicència Creative Commons
|
Català
Castellano
English
