Exploració per autor "Altet Sanahujes, Josep"
Ara es mostren els items 95-114 de 122
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Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect
(2010)
Article
Accés obertThis Letter presents a solution for locating hot spots in active integrated circuits (IC) and devices. This method is based on sensing the phase lag between the power periodically dissipated by a device integrated in an ... -
Màquines d'estats finits
(Departament d'Enginyeria Electrònica, 2015-03-26)
Audiovisual
Accés obert -
Monitor strategies for variability reduction considering correlation between power and timing variability
(IEEE Press. Institute of Electrical and Electronics Engineers, 2011)
Text en actes de congrés
Accés restringit per política de l'editorialAs CMOS technology scales, Process, Voltage and Temperature (PVT) variations have an increasing impact on, performance and power consumption of the electronic devices. Variability causes an undesirable dispersion of ... -
MOSFET dynamic thermal sensor for IC testing applications
(2016-05-01)
Article
Accés obertThis paper analyses how a single metal-oxide-semiconductor field-effect transistor (MOSFET) can be employed as a thermal sensor to measure on-chip dynamic thermal signals caused by a power-dissipating circuit under test ... -
Non-invasive Monitoring of CMOS Power Amplifiers Operating at RF and mmW Frequencies using an On-chip Thermal Sensor
(IEEE Press. Institute of Electrical and Electronics Engineers, 2011)
Text en actes de congrés
Accés restringit per política de l'editorialIn this paper a non-invasive, contact-less technique for the on-chip observation of PA operation is presented. It uses a differential temperature sensor that transduces the temperature increase due to the power dissipated ... -
Non-invasive RF built-in testing using on-chip temperature sensors
(IEEE Computer Society Publications, 2009-11)
Altres
Accés obertThis poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors. -
On evaluating temperature as observable for CMOS technology variability
(2010-05-26)
Text en actes de congrés
Accés obertThe temperature at surface of a silicon die depends on the activity of the circuits placed on it. In this paper, it is analyzed how Process, Voltage and Temperature (PVT) variations affect simultaneously some figures ... -
On line monitoring of RF power amplifiers with embedded temperature sensors
(IEEE, 2012)
Text en actes de congrés
Accés restringit per política de l'editorialIn the present paper we analyze that DC temperature measurements of the silicon surface can be used to monitor the high frequency status and performances of class A RF Power Amplifiers. As a proof of concept, we present ... -
On the use of static temperature measurements as process variation observable
(2012-10)
Article
Accés restringit per política de l'editorialIn this paper we present the use of static temperature measurements as process variation observable. Contrary to previously published thermal testing methods, the proposed methodology does not need an excitation signal, ... -
On-chip thermal testing using MOSFETs in weak inversion
(2015-02-01)
Article
Accés obertThis paper analyzes the feasibility of using metal-oxide-semiconductor field-effect transistors (MOSFETs) operating in weak inversion as temperature sensors for on-chip thermal testing applications. MOSFETs in weak inversion ... -
Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging
(2018-01-01)
Article
Accés obertThe viability of using off-chip single-shot imaging techniques for local thermal testing in integrated Radio Frequency (RF) power amplifiers (PA’s) is analyzed. With this approach, the frequency response of the output power ... -
Posada en marxa d'un laboratori de mesura, control i formació en les tecnologies involucrades
(2004)
Pòster (projecte CCD)
Accés obert -
Registres
(Departament d'Enginyeria Electrònica, 2015-03-26)
Audiovisual
Accés obert -
Review of temperature sensors as monitors for RFMMW built-in testing and self-calibration schemes
(Institute of Electrical and Electronics Engineers (IEEE), 2014)
Text en actes de congrés
Accés restringit per política de l'editorialThis paper presents an overview of the work done so far related to the use of temperature sensors as performance monitors for RF and MMW circuits with the goal to implement built-in testing or self-calibration techniques. ... -
Single-MOSFET DC thermal sensor for RF-amplifier central frequency extraction
(2017-09-01)
Article
Accés obert© 2017 Elsevier B.V. A DC thermal sensor based on a single metal-oxide-semiconductor field-effect transistor (MOSFET) is proposed to extract high-frequency electrical features of embedded circuits. The MOSFET sensor is ... -
Spatially and frequency-resolved monitoring of intradie capacitive coupling by heterodyne excitation infrared lock-in thermography
(2013-02-05)
Article
Accés restringit per política de l'editorialThis paper combines the infrared lock-in thermography (IR-LIT) and heterodyne excitation techniques to detect high-frequency capacitive currents due to intradie electrical coupling between microelectronic devices or more ... -
Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements
(2010-06-08)
Article
Accés obertThis paper presents two approaches to characterize RF circuits with built-in differential temperature measurements, namely the homodyne and heterodyne methods. Both non-invasive methods are analyzed theoretically and ... -
Study of heat sources interacting in integrated circuits by laser mirage effect
(2014-08-25)
Article
Accés restringit per política de l'editorialThis work exploits the mirage effect to analyze multiple heat sources thermally interacting in an integrated circuit (IC) by means of a probe IR laser beam, which strikes on the die lateral walls and passes through the die ... -
Survey of robustness enhancement techniques for wireless systems-on-a-chip and study of temperature as observable for process variations
(2011-06)
Article
Accés restringit per política de l'editorialBuilt-in test and on-chip calibration features are becoming essential for reliable wireless connectivity of next generation devices suffering from increasing process variations in CMOS technologies. This paper contains ... -
Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits
(2013)
Text en actes de congrés
Accés restringit per política de l'editorialThis paper introduces a novel on-chip measurement technique for the determination of the central frequency and 3dB bandwidth of a 60GHz power amplifier (PA) by performing low frequency temperature measurements in silicon ...
