Ara es mostren els items 1-20 de 51

    • 8T SRAM Cell with Open Defects under Voltage and Timing Variations 

      Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Castillo Muñoz, Raul (2011)
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    • An Efficient behavioral description frontend tool for mixed-mode SPICE simulation 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan; Chatterjee, Abhijit (2014)
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    • Analog circuit test based on a digital signature 

      Gómez Pau, Álvaro; Sanahuja Moliner, Ricard; Balado Suárez, Luz María; Figueras Pàmies, Joan (2010)
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      Production verification of analog circuit specifica- tions is a challenging task requiring expensive test equipment and time consuming procedures. This paper presents a method for low cost on-chip parameter verification ...
    • Analog circuits testing using digitally coded indirect measurements 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (Institute of Electrical and Electronics Engineers (IEEE), 2015)
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      Testing mixed-signal circuits is a challenging task requiring high amounts of human and technical resources. To overcome these drawbacks, indirect testing methods have been adopted as an efficient solution to perform ...
    • Análisis del retardo en enlaces con protocolos ARQ y control de flujo: aplicación a una red estrella 

      Rubio Sola, Jose Antonio; Figueras Pàmies, Joan (Marcombo, 1983)
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      El objetivo de este trabajo se enmarca en el desarrollo de herramientas de cuantificación de los tiempos de retardo en redes de computadores. El análisis se ha centrado en la evaluación del tiempo medio de retardo en el ...
    • BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing 

      Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan (Institute of Electrical and Electronics Engineers (IEEE), 2013)
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      Through Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs). The detection of defective TSVs in the earliest process step is of major concern. Hence, testing TSVs is usually done ...
    • Built-In Sensor for Signal Integrity Faults in Digital Interconnect Signals 

      Champac Vilela, Víctor Hugo; Avendaño, Victor; Figueras Pàmies, Joan (2010-02)
      Article
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      Testing of signal integrity (SI) in current high-speed ICs, requires automatic test equipment test resources at the multigigahertz range, normally not available. Furthermore, for most internal nets of state-of-the-art ...
    • Built-In test of MEMS capacitive accelerometers for field failures and aging degradation. 

      Gómez Pau, Álvaro; Sanahuja Moliner, Ricard; Balado Suárez, Luz María; Figueras Pàmies, Joan (2012)
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    • Criteria for indirect measurements in M-S testing 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2014)
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      Analog and mixed-signal circuit testing is a cballenging task demanding large amounts of resources. In order to battle against this drawback, alternate testing has been established as an eflicient way of testing analog ...
    • Criteria for selecting a subset of indirect measurements for analog testing 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2016)
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      This work proposes a criterion to select a subset of indirect measurements avoiding redundant information. The key idea of the proposal is to reduce the actual number of measurements to be performed to those strictly ...
    • Defective Behaviour of an 8T SRAM Cell with Open Defects 

      Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Manich Bou, Salvador; Figueras Pàmies, Joan; Di Carlo, Stefano; Prinetto, Paolo; Scionti, Alberto (2010)
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    • Diagnosis of full open defects in interconnect lines with fan-out 

      Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, C.; Kruseman, Bram (IEEE Press. Institute of Electrical and Electronics Engineers, 2010-05-24)
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      The development of accurate diagnosis methodologies is important to solve process problems and achieve fast yield improvement. As open defects are common in CMOS technologies, accurate diagnosis of open defects becomes ...
    • Diagnosis of full open defects in interconnecting lines 

      Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, Camelia; Kruseman, Bram; Lousberg, M.; Majhi, A.K. (IEEE, 2007-05-31)
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      A proposal for enhancing the diagnosis of full open defects in interconnecting lines of CMOS circuits is presented. The defective line is first classified as fully opened by means of a logic-based diagnosis tool (Faloc). ...
    • Digital signature generator for mixed-signal testing 

      Sanahuja Moliner, Ricard; Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (IEEE Computer Society Publications, 2009)
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      Es presenta un nou generador de signatures digitals per controlar dues senyals anàlogues. Es presenta la tecnologia STM 65 nm per demostrar la viabilitat de la proposta.
    • Efficient production binning using octree tessellation in the alternate measurements space 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (2015)
      Article
      Accés obert
      Binning after volume production is a widely accepted technique to classify fabricated ICs into different clusters depending on different degrees of specification compliance. This allows the manufacturer to sell non optimal ...
    • Evaluation of safety-oriented two-version architectures 

      Carrasco, Juan A.; Figueras Pàmies, Joan; Kuntzman, A (1991-03)
      Article
      Accés obert
      A Markov model taking into account physical and design faults for a two-version architecture oriented to safety-related applications is developed. Only a probabilistic knowledge of the initial state of the versions in ...
    • Gate leakage impact on full open defects in interconnect lines 

      Arumi Delgado, Daniel; Rodríguez Montañés, Rosa; Figueras Pàmies, Joan; Eichenberger, Stefan; Hora, Camelia; Kruseman, Bram (2011-06)
      Article
      Accés obert
      An Interconnect full open defect breaks the connection between the driver and the gate terminals of downstream transistors, generating a floating line. The behavior of floating lines is known to depend on several factors, ...
    • Identification of component deviations in analog circuits using digital signatures 

      Gómez Pau, Álvaro; Sanahuja Moliner, Ricard; Balado Suárez, Luz María; Figueras Pàmies, Joan (2011)
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      Analog circuits component diagnosis is a challenging task requiring expensive resources. This paper presents a low cost method to identify deviations in multiple component values using a precharacterisation of the impact ...
    • Impact of gate tunnelling leakage on CMOS circuits with full open defects 

      Rodríguez Montañés, Rosa; Arumi Delgado, Daniel; Figueras Pàmies, Joan; Eichenberger, S.; Hora, Camelia; Kruseman, B. (Institution of Electrical Engineers, 2007-10)
      Article
      Accés obert
      Interconnecting lines with full open defects become floating lines. In nanometric CMOS technologies, gate tunnelling leakage currents impact the behaviour of these lines, which cannot be considered electrically isolated ...
    • Improving indirect test efficiency using multi-directional tessellations in the measure space 

      Gómez Pau, Álvaro; Balado Suárez, Luz María; Figueras Pàmies, Joan (Institute of Electrical and Electronics Engineers (IEEE), 2016)
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      Indirect test strategies have risen as a promising solution to overcome the challenges encountered in analog and mixed-signal circuit testing and the ever increasing device verification costs. This work explores the ...