Exploració per tema "Circuits integrats digitals -- Disseny i construcció"
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Post-Bond test of through-silicon vias with open defects
(2014)
Text en actes de congrés
Accés restringit per política de l'editorialThrough Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs) and are susceptible to undergo defects at different stages: during their own fabrication, the bonding stage or during ...