Now showing items 1-11 of 11

  • DC temperature measurements for power gain monitoring in RF power amplifiers 

    Altet Sanahujes, Josep; Mateo Peña, Diego; Gómez Salinas, Dídac; Perpiñà, Xavier; Jordà, Xavier (IEEE, 2012)
    Conference report
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    In this paper we demonstrate that the steady state temperature increase due to the power dissipated by the circuit under test can be used as observable to test the gain of a 2GHz linear class A Power Amplifier. As a proof ...
  • Efficiency determination of RF linear power amplifiers by steady-state temperature monitoring using built-in sensors 

    Altet Sanahujes, Josep; Gómez, Didac; Perpinyà, X.; Mateo Peña, Diego; González, José Luis; Vellvehi, Miquel; Jordà, Xavier (2013-04)
    Article
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    This work aims at showing a new approach for determining the efficiency of linear class A RF power amplifiers by means of non-invasive, steady-state thermal monitoring. The theoretical basis of the technique is indicated ...
  • Electro-thermal characterization of a differential temperature sensor and the thermal coupling in a 65nm CMOS IC 

    Altet Sanahujes, Josep; González Jiménez, José Luis; Gómez Salinas, Dídac; Perpiñà, Xavier; Grauby, Stephane; Dufis, Cédric Yvan; Vellvehi, Miquel; Mateo Peña, Diego; Dilhaire, Stefan; Jordà, Xavier (2012)
    Conference report
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    This paper explains the design decisions and the different measurements we have done in order to characterize the thermal coupling and the ch aracteristics of temperature sensors embedded in a integrated circuit ...
  • Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers 

    Altet Sanahujes, Josep; González, José Luis; Gómez Salinas, Dídac; Perpiñà Gilabet, Xavier; Claeys, Wilfrid; Grauby, Stéphane; Dufis, Cédric Yvan; Vellvehi, Miquel; Mateo Peña, Diego; Reverter Cubarsí, Ferran; Dilhaire, Stefan; Jordà, Xavier (2014-05)
    Article
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    This paper reports on the design solutions and the different measurements we have done in order to characterize the thermal coupling and the performance of differential temperature sensors embedded in an integrated circuit ...
  • High-power test device for package thermal assessment and validation of thermal measuremetn tecniques 

    Jordà, Xavier; Perpiñà, Xavier; Vellvehi, Miquel; Madrid, Francesc; Altet Sanahujes, Josep (IEEE Computer Society Publications, 2010)
    Conference report
    Open Access
    This paper describes the structure and thermal behavior of a high-power thermal test chip (up to 200 W/cm2) designed for power electronics package assessment, which has also been used for the validation of thermal ...
  • Hot spot detection in integrated circuits laterally accessing to the substrate 

    Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel (2010)
    Conference report
    Open Access
    Thermal management of nano estructures requires the use of temperature monitoring strategies. In this work we expose a strategy bases on sensing the heat-flux within the chip substrate with a probe-laser beam. As the beam ...
  • Hot spot detection in integrated circuits laterally accessing to their substrate using a laser beam 

    Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel (IEEE Computer Society Publications, 2010)
    Conference report
    Open Access
    In this paper we present an electro-thermal coupling simulation technique for RF circuits. The proposed methodology takes advantage of well established tools for frequency translating circuits in order to significantly ...
  • Location of hot spots in integrated circuits by monitoring the substrate thermal-phase lag with the mirage effect 

    Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel; Mestres, Narcís (2010)
    Article
    Open Access
    This Letter presents a solution for locating hot spots in active integrated circuits (IC) and devices. This method is based on sensing the phase lag between the power periodically dissipated by a device integrated in an ...
  • Review of temperature sensors as monitors for RFMMW built-in testing and self-calibration schemes 

    Altet Sanahujes, Josep; Aldrete Vidrio, Héctor; Reverter Cubarsí, Ferran; Gómez Salinas, Dídac; Gonzalez Jimenez, J. L.; Onabajo, Marvin; Silva Martinez, Jose; Martineau, B.; Perpiñà Gilabet, Xavier; Abdallah, Louay; Stratigopoulos, Haralampos-G.; Aragonès Cervera, Xavier; Jordà, Xavier; Vellvehi, Miquel; Dilhaire, Stefan; Mir, Salvador; Mateo Peña, Diego (Institute of Electrical and Electronics Engineers (IEEE), 2014)
    Conference report
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    This paper presents an overview of the work done so far related to the use of temperature sensors as performance monitors for RF and MMW circuits with the goal to implement built-in testing or self-calibration techniques. ...
  • Spatially and frequency-resolved monitoring of intradie capacitive coupling by heterodyne excitation infrared lock-in thermography 

    León, J.; Perpiñà, Xavier; Altet Sanahujes, Josep; Vallvehi, Miquel; Jordà, Xavier (2013-02-05)
    Article
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    This paper combines the infrared lock-in thermography (IR-LIT) and heterodyne excitation techniques to detect high-frequency capacitive currents due to intradie electrical coupling between microelectronic devices or more ...
  • Study of heat sources interacting in integrated circuits by laser mirage effect 

    Perpiñà Gilabet, Xavier; Jordà, Xavier; Vellvehi, Miquel; Altet Sanahujes, Josep (2014-08-25)
    Article
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    This work exploits the mirage effect to analyze multiple heat sources thermally interacting in an integrated circuit (IC) by means of a probe IR laser beam, which strikes on the die lateral walls and passes through the die ...